| 摘要 |
FIELD: physics. ^ SUBSTANCE: invention relates to a method and a device for permanent connection of integrated circuits to a substrate. The said method involves permanent connection of integrated circuits (1) to at least one underlying substrate (2) using an adhesive (3) placed in between and around the edges of the integrated circuits (1), with a light source (19) with wavelength 280-900 nm being directed to the assembly which includes a substrate (2) and one integrated circuit (1), where the light source is directed to the upper side and/or lower side of the assembly, and energy of such polymerisation light effect (6b) is at least 5 lm/s, and mainly 100 lm/s. ^ EFFECT: invention prevents any possible damage to circuit components during permanent connection of integrated circuits to a substrate using an adhesive. ^ 8 cl, 6 dwg |
