| 发明名称 |
Thermally Conductive Encapsulant Material for a Capacitor Assembly |
| 摘要 |
A capacitor assembly that comprises a housing, a capacitor element that is hermetically sealed within the housing, and a thermally conductive material that at least partially encapsulates the capacitor element is provided. The capacitor element includes a sintered anode body, a dielectric overlying the anode body, and a solid electrolyte overlying the dielectric. The thermally conductive material has a thermal conductivity of about 1 W/m-K or more as determined in accordance with ISO 22007-2:2014. |
| 申请公布号 |
US2016268053(A1) |
申请公布日期 |
2016.09.15 |
| 申请号 |
US201514657245 |
申请日期 |
2015.03.13 |
| 申请人 |
AVX Corporation |
发明人 |
Petrzilek Jan;Navratil Jiri;Biler Martin |
| 分类号 |
H01G9/00;H01G9/032;H01G9/042;H01G9/08 |
主分类号 |
H01G9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A capacitor assembly comprising:
a housing; a capacitor element that is hermetically sealed within the housing, wherein the capacitor element includes a sintered anode body, a dielectric overlying the anode body, and a solid electrolyte overlying the dielectric; and a thermally conductive material that at least partially encapsulates the capacitor element, wherein the thermally conductive material has a thermal conductivity of about 1 W/m-K or more as determined in accordance with ISO 22007-2:2014. |
| 地址 |
Fountain Inn SC US |
