发明名称 MOLDING DIE AND IN-MOLD COATING MOLDING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To suppress occurrence of burr which is produced on a part surface.SOLUTION: After a resin 201 is injected and solidified, an interval between a first mold 101 and a second mold 102 is opened by a prescribed amount while keeping a state in which a third mold 103 is pressed to the second mold 102, so that, even when the resin 201 is shrunk, the third mold 103 can move accompanied with the shrinkage, and production of a clearance due to shrinkage is suppressed. Thus, even when a coating having good fluidity is used, occurrence of burr can be suppressed.SELECTED DRAWING: Figure 4
申请公布号 JP2016203474(A) 申请公布日期 2016.12.08
申请号 JP20150087169 申请日期 2015.04.22
申请人 PANASONIC IP MANAGEMENT CORP 发明人 YUKI MASAHIRO;OKANO SHUSUKE
分类号 B29C45/16;B29C45/26 主分类号 B29C45/16
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