发明名称 RESIN COMPOSITION, ADHESIVE, AND MOLDED BODY THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a composition as an adhesive to metal which has excellent adhesiveness even at a temperature of 100°C or lower, has small heat shrinkability, where a composition obtained in the form of a pellet or powder is excellent in blocking resistance even at normal temperature and can be subjected to extrusion molding without requiring a special crushing treatment during use, and an obtained molded body has excellent handleability; and to provide an adhesive and a molded article formed of the same.SOLUTION: There are provided a hot-melt adhesive composition containing 0.1-50 pts.wt. of a saponified product (B) of an ethylene-vinyl acetate copolymer based on 100 pts.wt. of an ethylene acid copolymer (A); and an adhesive and a molded body formed of the same.SELECTED DRAWING: None
申请公布号 JP2016188337(A) 申请公布日期 2016.11.04
申请号 JP20150069561 申请日期 2015.03.30
申请人 TOSOH CORP 发明人 OTAKE MASATO
分类号 C08L23/08;C08L29/04;C09J123/08 主分类号 C08L23/08
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