发明名称 APPARATUS FOR ATTACHING SUBSTRATES
摘要 An apparatus for attaching substrates is provided to minimize an error rate of products by preventing a metal foreign substance form being mixed with a sealing material or a liquid material. An apparatus for attaching substrates includes a lower chamber(200), an upper chamber(100), and an ejection unit(230). At least one position determination pin is upwardly protruded from the lower chamber(200). The upper chamber(100) has a position determination hole into which the position determination pin is inserted to be aligned with the lower chamber(200). The ejection unit(230) is formed to be connected with outside on a circumference of the position determination pin. An injection unit which is connected to a predetermined gas supply source is installed on a circumference of the position determination hole. The ejection unit(230) is connected to a vacuum pump.
申请公布号 KR20070101619(A) 申请公布日期 2007.10.17
申请号 KR20060032841 申请日期 2006.04.11
申请人 ADP ENGINEERING CO., LTD. 发明人 PARK, SI HYUN
分类号 H05K13/04 主分类号 H05K13/04
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