发明名称 PROBE CARD FOR WAFER TEST
摘要 PROBLEM TO BE SOLVED: To provide a probe card for a wafer test capable of a block repair easily and rapidly, the probe card for the wafer test has a simple structure in which a PCB pad and a needle can be connected directly, keeping a stable electric property. SOLUTION: The probe card is used in a probing device for an electric property inspection for the semiconductor wafer; an arrangement of a pattern is carried out on an insulation substrate; the PCB pad forming the first and second penetrating holes which are penetrating the front and rear surfaces is formed; the penetrating hole trench penetrating the front and rear surfaces is formed; a fourth reinforced plate forming an insertion part inserting into the second penetrating hole of the PCB pad is arranged; a probe block in which an needle ash part fixing a plurality of needles is mounted on one side and an insertion part inserting along the first penetrating hole of the PCB pad and the penetrating hole of the fourth reinforced plate is mounted on the other side is arranged; a fifth reinforced plate connecting with the insertion part of the probe block which is inserted along the penetrating hole of the fourth reinforced plate and the penetrating hole of the PCB pad fixing the rear surface of the fourth reinforced plate in freely adhered state is prepared. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007322410(A) 申请公布日期 2007.12.13
申请号 JP20060219223 申请日期 2006.08.11
申请人 FROM 30 CO LTD 发明人 OH HUN PIL;CHO JUN SOO;KIM JUN HEUNG
分类号 G01R1/073;G01R31/26;H01L21/66 主分类号 G01R1/073
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