| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil which exhibits excellent adhesion between a resin and a copper foil in a step of processing a fine wiring circuit or in forming a multi-layer. SOLUTION: The copper foil is treated with a silicone oligomer containing at least one functional group reactive with a hydroxyl group on a surface of a substrate material which is obtained previously by three-dimensional condensation reaction on a copper foil of Rz 3.7μm or less, and at least one organic functional group reactive with a resin at the terminal positions, and preferably is further treated with a silane coupling agent. COPYRIGHT: (C)2008,JPO&INPIT
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