| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently prevent resin burr 91 from being stuck and formed on a frame 5 mounting an LED chip (light-emitting element) 4. <P>SOLUTION: First, a tape application frame 13 is formed by applying the tape 12 for preventing the resin burr on a surface 5a not mounted with a light-emitting element of the frame 5 mounting the LED chip 4, the tape application frame 13 is supplied to set on a set part 7 of an upper mold 2 in such a state that the LED chip 4 side is directed downward, and requirement of a liquid resin material 10 having transparency is supplied by dropping in a large cavity 8 including a small cavity 9 with a dispenser 11. Next, the LED chip 4 is respectively separately immersed in the resin 10 of the small cavity 9 in the cavity 8 by clamping the both upper and lower molds 1 (a fixed upper mold 2, a movable lower mold 3) with a required mold clamping pressure, and compression molded to obtain a molded frame 61 (a light-emitting body 65). <P>COPYRIGHT: (C)2008,JPO&INPIT |
