SEMICONDUCTOR DEVICE, LED PRINT HEAD, AND IMAGE FORMING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which is capable of improving the reliability by suppressing the occurrence of poor connection or the like due to defects such as cracks in a constitution wherein ohmic electrodes on the sides of two conduction types are provided on one plane.

SOLUTION: In the semi-conductor device, light emitting regions formed like approximate rectangles on a light emitting element 120, a first conduction type-side electrode 122 electrically connected to one side of the light emitting element 120, and second conduction type-side electrodes 130 electrically connected to the other side of the light emitting element 120 are formed so as to be placed on one face side of a thin film of the light emitting element 120. The first conduction type-side electrode 122 has first and second electrode portions 122a and 122b in positions continuously surrounding the outside of at least two adjacent sides of the approximate rectangle of the corresponding light emitting region, and each second conduction type-side electrode 130 is arranged on the corresponding light-emitting region. A first conduction type-side wiring part 132 is provided over both of the first and second electrode portions 122a and 122b of the fist conduction type-side electrode 122.

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