发明名称 |
Polishing monitoring method and polishing apparatus |
摘要 |
The present invention provides a method of monitoring a change in film thickness during polishing using an eddy current sensor. This method includes acquiring an output signal of the eddy current sensor as a correction signal value during water-polishing of a substrate, during dressing of the polishing pad, or during replacement of the polishing pad, calculating a correcting amount from a difference between the correction signal value and a predetermined correction reference value, calculating an actual measurement signal value by subtracting the correction amount from the output signal of the eddy current sensor when polishing a substrate having a conductive film, and monitoring a change in thickness of the conductive film during polishing by monitoring a change in the actual measurement signal value.
|
申请公布号 |
US2009104847(A1) |
申请公布日期 |
2009.04.23 |
申请号 |
US20080285604 |
申请日期 |
2008.10.09 |
申请人 |
KOBAYASHI YOICHI;TAKAHASHI TARO;HIROO YASUMASA;OGAWA AKIHIKO;OHTA SHINROU |
发明人 |
KOBAYASHI YOICHI;TAKAHASHI TARO;HIROO YASUMASA;OGAWA AKIHIKO;OHTA SHINROU |
分类号 |
B24B51/00;B24B37/013;G01B7/06;H01L21/304 |
主分类号 |
B24B51/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|