SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF

摘要

Semiconductor package includes: a substrate having a cavity in which a light-emitting device mounting region is formed; a light-emitting device mounted in the light-emitting device mounting region; and a white reflection layer that is formed in the cavity and covers a bottom surface and an inner side wall of the cavity around the light-emitting device. The reflection layer includes at least one of TiO2, ZnO, lithopone, ZnS, BaS04, SiO2. PTFE (poly tetrafluoroe thy lene), the main materials being added by 5 to 60 wt%.