| 发明名称 |
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, RESIN VARNISH USING THE SAME, ADHESIVE FILM, PREPREG AND PRINTED WIRING BOARD |
| 摘要 |
A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent. |
| 申请公布号 |
US2016208143(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201514949177 |
申请日期 |
2015.11.23 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
SHIM Ji-Hye;KIM Ki-Seok;WOO Ji-Eun |
| 分类号 |
C09J7/02;C09J163/00;C09D163/00;C08K3/36 |
主分类号 |
C09J7/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition for a printed circuit board comprising:
an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent. |
| 地址 |
Suwon-si KR |
