| 发明名称 |
EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer. |
| 申请公布号 |
US2016219709(A1) |
申请公布日期 |
2016.07.28 |
| 申请号 |
US201614990046 |
申请日期 |
2016.01.07 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
LEE Joon-Sung;LEE Yong-Sam;AHN Seok-Hwan;CHOI Jae-Hoon |
| 分类号 |
H05K1/18;H05K1/02;H05K3/30;H05K3/00;H05K3/46;H05K1/11;H05K1/03 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An embedded board comprising:
an insulating layer; a first circuit layer formed inside the insulating layer; a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer; a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer; a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element; and a first via formed on an upper part of the second circuit layer inside the insulating layer. |
| 地址 |
Suwon-si KR |
