| 摘要 |
A semiconductor device (1)is provided with: a semiconductor chip (10) mounted on a supporting body (2) in a face-up state by die-bonding; an intermediate substrate (20), which is provided on the semiconductor chip, and connects the semiconductor chip to a plurality of external connecting sections (3); and a plurality of connecting bumps (6) that connect the semiconductor chip and the intermediate substrate to each other. The connecting bumps (6) include a plurality of power supply bumps (6V, 6G) for supplying power to the semiconductor chip by being connected to the electrode pads (11) on the semiconductor chip. The intermediate substrate has: a plurality of power supply pads (21V, 21G) that are connected to the electrode pads via the power supply bumps; a bump surface (22), which faces the semiconductor chip, and has the power supply pads formed thereon; an external connecting surface (24), which is the surface on the reverse side of the bump surface, and has formed thereon a plurality of external connecting pads connected to the external connecting sections; and a capacitor (30) connected to the power supply bumps. |
