发明名称 Enhanced EUV Lithography System
摘要 The present disclosure provides a semiconductor lithography system. The lithography system includes a projection optics component. The projection optics component includes a curved aperture. The lithography system includes a photo mask positioned over the projection optics component. The photo mask contains a plurality of elongate semiconductor patterns. The semiconductor patterns each point in a direction substantially perpendicular to the curved aperture of the projection optics component. The present disclosure also provides a method. The method includes receiving a design layout for a semiconductor device. The design layout contains a plurality of semiconductor patterns each oriented in a given direction. The method includes transforming the design layout into a mask layout. The semiconductor patterns in the mask layout are oriented in a plurality of different directions as a function of their respective location.
申请公布号 US2016327854(A1) 申请公布日期 2016.11.10
申请号 US201615211229 申请日期 2016.07.15
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chang Ching-Hsu;Cheng Nian-Fuh;Chou Chih-Shiang;Huang Wen-Chun;Liu Ru-Gun
分类号 G03F1/22;G03F7/20 主分类号 G03F1/22
代理机构 代理人
主权项 1. A semiconductor fabrication apparatus, comprising: a lithography mask having a plurality of patterns, wherein at least one of the plurality of patterns is shaped as a parallelogram in a top view.
地址 Hsin-Chu TW