发明名称 TOOL FOR PLATING, AND PLATING METHOD AND PLATING APPARATUS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a transporting tool for plating by which an electronic component is easily mounted on a cathode without necessitating a positioning member for inserting the lead part of the electronic component, the electronic component is easily released from the cathode and in addition, only a part of the electronic component can be plated, and a plating method and a plating apparatus. SOLUTION: The electrolytic treatment is carried out by having the cathode 24 and a magnetic field generating means 28 provided to freely attach and detach the electronic component 1 above the transporting tool 10 for plating and attracting and releasing the electronic component 1 to/from the cathode 24 by the magnetic field generating means 28. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007239045(A) 申请公布日期 2007.09.20
申请号 JP20060064474 申请日期 2006.03.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAITO YASUAKI
分类号 C25D17/06;C25D5/08;C25D7/00;C25D17/08 主分类号 C25D17/06
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