| 摘要 |
A substrate B for use in production of a semiconductor device is used, which substrate includes an adhesive sheet 50 having a base layer 51 and an adhesive layer 52, and a plurality of independently provided electrically conductive portions 20. A semiconductor element having electrodes 11 formed thereon is firmly fixed onto the substrate B, and upper portions of the plurality of electrically conductive portions 20 and the electrodes 11 of the semiconductor element 10 are electrically connected by using wires 30. The semiconductor element 10, wires 30 and electrically conductive portions 20 are sealed by using a sealing resin 40. Each of the electrically conductive portions 20 has overhanging portions 20 a, and a side face 60 a of the electrically conductive portion 20 is roughened, thus enhancing the joining strength between each electrically conductive portion 20 and the sealing resin 40.
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