| 摘要 |
PROBLEM TO BE SOLVED: To adhere surely a heat sink to a semiconductor element. SOLUTION: Fastening-axis portions 11, 11 provided on the horizontal axis passed through the gravity center of the heat sink 5 are supported by receiving portions 15, 15, and thereby, such a rotating displacement of the heat sink 5 as to be inclined by its self-weight is not generated. Also, the clamping forces of four fastening bolts 12, 12, ... are so adjusted as to adjust finely the front and rear inclinations of the heat sink 5 which are performed along a vertical plane orthogonal to a supporting plate 14 of the heat sink 5 and as to adjust finely the left and right inclinations of the heat sink 5 which are performed along a horizontal plane about a vertical line. COPYRIGHT: (C)2008,JPO&INPIT
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