| 摘要 |
PROBLEM TO BE SOLVED: To provide an efficient probing method capable of reducing the influence of a stray capacity. SOLUTION: A multi-probe card is used, which is formed in the upper part of a wafer and has a plurality of pairs of probe needles to be simultaneously and electrically brought into contact with a plurality of semiconductor elements which are mutually separately arranged by the same number (not less than one). In a first process, the wafer is moved by each one of the semiconductor elements with respect to the multi-probe card, so as to successively measure the plurality of semiconductor elements in a fixed area. In a second process, the wafer is moved for the portion of the measured fixed area after completion of measurement of the semiconductor elements in the fixed area. The semiconductor elements formed on the wafer are measured by alternately repeating the first and second processes. COPYRIGHT: (C)2008,JPO&INPIT
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