| 摘要 |
<p>This object aims to provide a surface acoustic wave device configured not to easily cause a melting resin pressure at molding resin layer forming time to deform the device and not to easily cause deterioration in characteristic even when miniaturization, particularly, making the device thin in thickness is carried out. A surface acoustic wave device (1) is provided with an IDT electrode (3) formed on a piezoelectric substrate (2), an insulating member (18) formed on the piezoelectric substrate (2) to define a space (B) arranged to surround the IDT electrode (3) and reflectors (4, 5) arranged at both sides of the IDT electrode (3) to make the space (B) small in area, wherein the reflectors (4, 5) are composed of weighted finger electrodes that are weighted by making lengths of the finger electrodes shorter as the finger electrodes become farther from the IDT electrode (3) side to the IDT electrode (3) so that the space (B) is made small in shape in accordance with the lengths of the finger electrodes.</p> |
