发明名称 MEASURING METHOD, INSPECTING METHOD, MEASURING APPARATUS AND INSPECTING APPARATUS
摘要 <p>An intersection position of reflection light of two line illuminations (21, 22), which are coaxial with a vertical camera (11) and orthogonally intersect with each other, is obtained, and an intersection position of reflection light of the two line illuminations (21, 23), which are coaxial with a tilted camera (12) and orthogonally intersect with each other, is obtained. Then, from the parallax difference, the center three-dimensional coordinates of a solder ball are obtained. An edge section of the solder ball is illuminated by a profile illumination (24), and a radius is obtained as a distance from the center position to the edge section from an image obtained by the tilted camera (12). Then, the height of the solder ball is obtained by adding the height of the center to the radius of the solder ball. Thus, a technology is provided for accurately measuring the position of a mirror-finished spherical body even the surface thereof is rough. The X (Y) coordinates of the intersection of the reflection light are preferably obtained as X (Y) coordinates where luminance value obtained by integration in the Y(X) direction is at maximum.</p>
申请公布号 WO2009075330(A1) 申请公布日期 2009.06.18
申请号 WO2008JP72531 申请日期 2008.12.11
申请人 OMRON CORPORATION;MITSUMOTO, DAISUKE;YOSHINO, MASANAO;HONMA, YUKI;OGINO, HIROTAKA 发明人 MITSUMOTO, DAISUKE;YOSHINO, MASANAO;HONMA, YUKI;OGINO, HIROTAKA
分类号 G01B11/02;G01B11/00 主分类号 G01B11/02
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