发明名称 |
Conductive resin composition, method for manufacturing electronic component using same, bonding method, bonding structure, and electronic component |
摘要 |
A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or pitch-derived fine carbon pieces is used to electrically bond two conductive elements. The conductive resin composition is supplied to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas. |
申请公布号 |
US9491868(B2) |
申请公布日期 |
2016.11.08 |
申请号 |
US201113206693 |
申请日期 |
2011.08.10 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
Onoue Tomoaki;Hirayama Masaaki;Aburatani Yoshiki |
分类号 |
H01R4/04;H05K3/32;H01R4/58;H01R4/00 |
主分类号 |
H01R4/04 |
代理机构 |
Arent Fox LLP |
代理人 |
Arent Fox LLP |
主权项 |
1. A bonding structure bonding one conductor to the other conductor so as to be electrically connected, comprising a pair of conductors with a cured conductive resin composition comprising (a) a cured resin and (b) hard spherical carbon having an average particle diameter of 10 μm or less, the hard spherical carbon itself having a compression strength of 200 MPa or more, and the hard spherical carbon comprising solid spherical carbon particles whose surface is coated with fine carbon particles or pitch-derived fine carbon pieces or both interposed between the conductors, wherein the hard spherical carbon in the conductive resin composition is hard amorphous carbon and has a higher hardness than either member of the pair of conductors, and wherein a part of the solid spherical carbon particles and the fine carbon on the surface of the solid spherical carbon particles are incorporated into a surface of both conductors. |
地址 |
Nagaokakyo-Shi, Kyoto-Fu JP |