| 发明名称 | Connection structure of electronic device | ||
| 摘要 | A connection structure of an electronic device includes a circuit board, a plurality of conductive contact pads and a conductive pattern. The conductive contact pads and the conductive pattern are disposed on the circuit board. The conductive contact pads are electrically insulated from one another. The conductive pattern is electrically insulated from the conductive contact pads. The conductive pattern is disposed on at least three sides of the conductive contact pads so as to generate an electrostatic discharge protection effect for the conductive contact pads. | ||
| 申请公布号 | US9491851(B2) | 申请公布日期 | 2016.11.08 |
| 申请号 | US201414339470 | 申请日期 | 2014.07.24 |
| 申请人 | WINTEK CORPORATION | 发明人 | Lin Jung-Sung;Lee Hsua-Yun;Chi Pin-Hao;Lin Chih-Yuan;Lin Ming-Chuan |
| 分类号 | H02H9/00;H05K1/02;H05F3/00;H05F3/02;H01R13/648;H01R12/71;H01R12/70;H01R12/77;H05K1/11 | 主分类号 | H02H9/00 |
| 代理机构 | Sinorica, LLC | 代理人 | Chow Ming;Sinorica, LLC |
| 主权项 | 1. A connection structure of an electronic device, comprising: a circuit board; a plurality of conductive contact pads, disposed on the circuit board, wherein the conductive contact pads are electrically insulated from one another; and a conductive pattern, disposed on the circuit board, wherein the conductive pattern is disposed on at least three sides of the conductive contact pads so as to generate an electrostatic discharge protection effect for the conductive contact pads, wherein the conductive pattern surrounds the conductive contact pads, the conductive pattern includes a closed pattern having a hollow region, and all of the conductive contact pads are disposed in the hollow region. | ||
| 地址 | Taichung TW | ||