Electronic component

摘要

A mounting structure includes an electronic component mounted on a circuit board. Land electrodes are disposed on a board body and are connected to outer electrodes of the electronic component through solders, respectively. A distance from each of the land electrodes to a top of the corresponding solder is not larger than about 1.27 times a distance from each of the land electrodes to an exposed portion of a capacitor conductor exposed at an end surface of the electronic component, the capacitor conductor being positioned closest to the circuit board.

主权项

1. A mounting structure including an electronic component mounted on a board, wherein the electronic component comprises:
a laminate including a plurality of laminated dielectric layers, a mounting surface that faces the board and that is positioned on one side of the laminate in a lamination direction, and a first end surface and a second end surface that are opposed to each other; a plurality of capacitor conductors laminated together with the dielectric layers to define a capacitor, and led out to the first end surface or the second end surface; a first outer electrode disposed to extend over the first end surface and partly over the mounting surface, and connected to the capacitor conductors; a second outer electrode disposed to extend over the second end surface and partly over the mounting surface, and connected to the capacitor conductors; wherein the board includes:
a board body; anda first land electrode and a second land electrode disposed on the board body, the first land electrode and the second land electrode being connected respectively to the first outer electrode and the second outer electrode through conductive materials; wherein a distance between the mounting surface and the capacitor conductor closest to the mounting surface is longer than a distance between a surface of the laminate opposed to the mounting surface and the capacitor conductor closest to the opposed surface; and H1/H2 is not greater than about 1.27, where H1 is a height from each of surfaces of the first and second land electrodes to a top of the respective conductive material connecting the first and second land electrodes to the respective first and second outer electrodes, and H2 is a height from each of the surfaces of the first and second land electrodes to the capacitor conductor closest to the mounting surface.