发明名称 SUPPORT FOR ELECTRONIC POWER COMPONENTS, POWER MODULE PROVIDED WITH SUCH A SUPPORT, AND CORRESPONDING PRODUCTION METHOD
摘要 This substrate for power electronic components comprises a colaminated multilayer composite material containing at least one internal layer (8) made of a material having a thermal expansion coefficient chosen depending on the expansion coefficient of said components, and external layers (6, 7) made of a thermally conductive material covering on either side said internal layer and connected together by wells (P) made of a thermally conductive material, said wells being arranged in the internal layer. Each interior layer forms an insert localized in a zone for mounting the components so that the external layers extend laterally beyond the insert.
申请公布号 EP3058591(A1) 申请公布日期 2016.08.24
申请号 EP20130795548 申请日期 2013.10.18
申请人 GRISET;LABORATOIRE NATIONAL DE METROLOGIE ET D'ESSAIS;ASSOCIATION POUR LA RECHERCHE ET LE DÉVELOPPEMENTDES MÉTHODES ET PROCESSUS INDUSTRIELS (ARMINES) 发明人 IDRAC, JONATHAN;KAABI, ABDERRAHMEN;BIENVENU, YVES;PIERRE, BERTRAND
分类号 H01L23/367;H01L23/373 主分类号 H01L23/367
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