发明名称 |
SUPPORT FOR ELECTRONIC POWER COMPONENTS, POWER MODULE PROVIDED WITH SUCH A SUPPORT, AND CORRESPONDING PRODUCTION METHOD |
摘要 |
This substrate for power electronic components comprises a colaminated multilayer composite material containing at least one internal layer (8) made of a material having a thermal expansion coefficient chosen depending on the expansion coefficient of said components, and external layers (6, 7) made of a thermally conductive material covering on either side said internal layer and connected together by wells (P) made of a thermally conductive material, said wells being arranged in the internal layer. Each interior layer forms an insert localized in a zone for mounting the components so that the external layers extend laterally beyond the insert. |
申请公布号 |
EP3058591(A1) |
申请公布日期 |
2016.08.24 |
申请号 |
EP20130795548 |
申请日期 |
2013.10.18 |
申请人 |
GRISET;LABORATOIRE NATIONAL DE METROLOGIE ET D'ESSAIS;ASSOCIATION POUR LA RECHERCHE ET LE DÉVELOPPEMENTDES MÉTHODES ET PROCESSUS INDUSTRIELS (ARMINES) |
发明人 |
IDRAC, JONATHAN;KAABI, ABDERRAHMEN;BIENVENU, YVES;PIERRE, BERTRAND |
分类号 |
H01L23/367;H01L23/373 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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