| 摘要 |
PROBLEM TO BE SOLVED: To provide a contact member ensuring good conductive connection between an electronic component and a mother board even when the electronic component is shrunk, and to its fabrication process. SOLUTION: Resilient arm 5b of a contact 5 can be deformed easily and surely utilizing internal stress. Since the resilient arm 5b of the contact 5 can be deformed easily and surely even if the contact 5 is shrunk in accordance with shrinkage of an electronic component 2, the resilient arm 5b of the contact 5 can function appropriately as a resilient contact, distortion caused by difference in thermal expansion coefficient between the electronic component 2 and the mother board 1 can be absorbed by the contact member provided between the electronic component 2 and the mother board 1 thus ensuring conductive connection between the electronic component 2 and the mother board 1. COPYRIGHT: (C)2006,JPO&NCIPI
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