AN ELECTRICAL CIRCUIT ASSEMBLY WITH IMPROVED SHOCK RESISTANCE

摘要

An assembly of the present invention includes a substrate (J) and an integrated circuit device (3) adapted to be electrically and mechanically attached to the substrate. Electrically conductive connecting elements (35) between the device and the substrate electrically connect the device and the substrate. At least one adhesive body (45) is positioned between the integrated circuit devic and the substrate to form a mechanical connection between the circuit device and the substrate. The at least one adhesive body comprises a non-thermosetting material which, which heated, releases said mechanical connection to allow removal of the circuit device from the substrate.