| 摘要 |
PROBLEM TO BE SOLVED: To stabilize the positioning accuracy of a discharge port from the reference point of positioning an external device and a printhead, to improve an adhesion reliability between an HB chip and a chip plate, and to reduce an investment in facilities and material costs. SOLUTION: The manufacturing method of the inkjet printhead comprises the steps of: holding a second wiring substrate in a state of being forcibly expanded enough to have no flexure nor floating of the wiring board by utilizing a second wiring substrate positioning hole or the like; and fixing the second wiring substrate and a chip tank unit through fastening in such a manner that the floating, the flexure, and a protrusion are kept within a specified dimension tolerance without bonding the wiring substrate bent along the side surface of the chip plate to the side surface of the chip plate, and also the flexure and the floating of the wiring substrate are not generated when the second wiring substrate connected to the wiring substrate by a heat-crimping is fastened and fixed to the chip tank unit. COPYRIGHT: (C)2008,JPO&INPIT
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