SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE

摘要

There is provided a semiconductor device manufacturing method which prevents cracking of an overcoat during polishing process, and a semiconductor wafer and a semiconductor device which have an overcoat free from cracking. A plurality of divided overcoats 10 are formed on each chip 3 in a chip region 2 and on each unavailable chip pattern in an unavailable region in the periphery of the chips 3 on the surface of a semiconductor wafer 1, and the semiconductor wafer 1 is mounted upside down on a table with an intervening film so that the back surface of the semiconductor wafer 1 is polished.