发明名称 MOLDED WIRE
摘要 PROBLEM TO BE SOLVED: To provide a molded wire excellent waterproofness.SOLUTION: According to an embodiment, a molded wire 10 comprises a conductor wire 14, an insulator 15 that coats the periphery of the conductor wire 14 and has a two layer structure composed of an inner layer 15a and an outer layer 15b comprising water repellent material, and a mold resin molding 13 that directly coats a terminal of the insulator 15.SELECTED DRAWING: Figure 1
申请公布号 JP2016195076(A) 申请公布日期 2016.11.17
申请号 JP20150075136 申请日期 2015.04.01
申请人 HITACHI METALS LTD 发明人 SUGITA KEISUKE;OHASHI MAMORU;SUZUKI YASUNORI
分类号 H01B7/00;H01B7/282;H02G1/14 主分类号 H01B7/00
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