发明名称 Light-emitting device
摘要 A light-emitting device includes a base, a light-emitting element, a wavelength conversion member, and a light reflecting member. The base has a base upper surface. The light-emitting element is provided on the base and includes a semiconductor layer, a light transmissive substrate, and a recess. The semiconductor layer is provided on the base so that a semiconductor lower surface faces the base upper surface of the base. The light transmissive substrate has a substrate upper surface, a substrate lower surface opposite to the substrate upper surface, and a substrate side surface between the substrate upper surface and the substrate lower surface. The light transmissive substrate is provided on the semiconductor layer so that the substrate lower surface contacts a semiconductor upper surface of the semiconductor layer. The recess is provided on the substrate upper surface of the light transmissive substrate. The wavelength conversion member is provided in the recess.
申请公布号 US9497824(B2) 申请公布日期 2016.11.15
申请号 US201514870007 申请日期 2015.09.30
申请人 NICHIA CORPORATION 发明人 Nakabayashi Takuya;Tamaki Hiroto
分类号 H01L33/50;H01L33/60;H05B33/22;F21V13/08 主分类号 H01L33/50
代理机构 Mori & Ward, LLP 代理人 Mori & Ward, LLP
主权项 1. A light-emitting device comprising: a first light-emitting element comprising: a semiconductor layer having a semiconductor upper surface and a semiconductor lower surface opposite to the semiconductor upper surface;a light transmissive substrate having a substrate upper surface, a substrate lower surface opposite to the substrate upper surface, and a substrate side surface between the substrate upper surface and the substrate lower surface, the light transmissive substrate being provided on the semiconductor layer so that the substrate lower surface contacts the semiconductor upper surface of the semiconductor layer; anda recess provided on the substrate upper surface of the light transmissive substrate; a wavelength conversion member provided in the recess; a first electrode provided on the semiconductor lower surface; a second electrode provided on the semiconductor lower surface separately from the first electrode; and a light reflecting member provided to cover the substrate side surface of the light transmissive substrate and provided between the first electrode and the second electrode.
地址 Anan-shi JP