| 发明名称 |
IMAGE SENSING DEVICE |
| 摘要 |
An image sensing device includes a printed circuit board, a chip package, and an adhesive layer. The printed circuit board has a concave portion. The chip package has a sensing surface and a bonding surface that is opposite to the sensing surface. The adhesive layer is disposed between the bonding surface of the chip package and the concave portion of the printed circuit board. The adhesive layer has an aggregation force. The chip package is bent through a surface of the concave portion and the aggregation force, such that the sensing surface of the chip package is an arc surface. |
| 申请公布号 |
US2016351607(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615166261 |
申请日期 |
2016.05.27 |
| 申请人 |
XINTEC INC. |
发明人 |
LIU Tsang-Yu;LIAO Chi-Chang |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image sensing device, comprising:
a printed circuit board having a concave portion; a chip package having a sensing surface and a bonding surface that is opposite to the sensing surface; and an adhesive layer disposed between the bonding surface of the chip package and the concave portion of the printed circuit board, wherein the adhesive layer has an aggregation force; and the chip package is bent through a surface of the concave portion and the aggregation force, such that the sensing surface of the chip package is an arc surface. |
| 地址 |
Taoyuan City TW |
