THERMALLY ENHANCED FACE-TO-FACE SEMICONDUCTOR ASSEMBLY WITH BUILT-IN HEAT SPREADER AND METHOD OF MAKING THE SAME

摘要

A face-to-face semiconductor assembly is characterized in that first and second semiconductor devices are face-to-face mounted on two opposite sides of a first routing circuitry and is further electrically connected to an interconnect board through the first routing circuitry. The interconnect board has a heat spreader to provide thermal dissipation for the second semiconductor device, and a second routing circuitry formed on the heat spreader and electrically coupled to the first routing circuitry. The first routing circuitry provides primary fan-out routing for the first and second semiconductor devices, whereas the second routing circuitry provides further fan-out wiring structure for the first routing circuitry.

主权项

1. A thermally enhanced face-to-face semiconductor assembly with a built-in heat spreader, comprising:
a subassembly that includes a first semiconductor device, a balance layer and a first routing circuitry having a first surface and an opposite second surface, wherein the first semiconductor device is electrically coupled to the first routing circuitry from the first surface of the first routing circuitry and the balance layer laterally surrounds the first semiconductor device and covers the first surface of the first routing circuitry; and a thermally enhanced component that is electrically coupled to the subassembly and includes a second semiconductor device, a heat spreader and a second routing circuitry disposed over the heat spreader, wherein (i) the second semiconductor device is attached to the heat spreader and laterally surrounded by the second routing circuitry and electrically coupled to the first routing circuitry by an array of first bumps, (ii) the second routing circuitry is electrically coupled to the first routing circuitry by an array of second bumps, and (iii) both the first bumps and the second bumps are disposed at the second surface of the first routing circuitry.