| 摘要 |
PROBLEM TO BE SOLVED: To improve coverage in an unlanded part of a via hole. SOLUTION: When an opening 14 is formed in an interlayer insulating film 13 where a lower wiring layer 12 is exposed, the selection ratio of the interlayer insulating layer 13 is lowered, with respect to the lower wiring layer 12. By having the end of the lower wiring layer 12 etched via the opening 14, the base of the opening 14 is made to incline toward the unlanded part 14a. COPYRIGHT: (C)2006,JPO&NCIPI
|
