摘要 |
<p>A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.</p> |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
BHATTACHARYA, RABIN;SNIJDER, PIETER, J.;VAN PIETERSON, LIESBETH;VAN DRIEL, JACQULINE;KRANS, MARTIJN;DOUGLAS, ALEXANDER, U.;ASVADI, SIMA;HACK, MARTINUS, J.J.;ZAINZINGER, ERICH |