| 摘要 |
The present invention relates to a grinder unit for a thin film substrate and a chamfering apparatus comprising the same which remove a portion of a thin film formed on a substrate such as a glass plate. The chamfering apparatus removes a thin film formed on a square substrate, and comprises: a first and a second grinder unit to grind the thin film along an edge of the substrate; and a drive unit to move positions of the first and the second grinder unit. The first and second grinder units each comprises: a chamfering unit to grind the thin film; and a suction unit to suck a residual material of the thin film created around the chamfering unit. |
