FILM FORMATION APPARATUS AND FILM FORMATION METHOD FORMING METAL FILM

摘要

Provided is film formation apparatus of a metal film and a film formation method therefor capable of forming a homogeneous metal film of a uniform thickness stably, while being less affected by the surface state of the anode. A film formation apparatus 1A includes: an anode 11; a solid electrolyte membrane 13 disposed between the anode 11 and a base B serving as a cathode; and a power supply unit 14 to apply voltage between the anode 11 and the base B, the film formation apparatus being configured so that, when the solid electrolyte membrane 13 is brought into contact with a surface of the base B, and voltage is applied between the anode 11 and the base B, metal is deposited on the surface of the base B from metal ions included inside of the solid electrolyte membrane 13, so that the metal film F made of the metal is formed. The film formation apparatus 1A includes a mounting base 21 on which the base B is to be placed, and the mounting base 21 has a suction unit 22 to suck the solid electrolyte membrane 13 from a side of the base B so that the solid electrolyte membrane 13 is brought into intimate contact with the surface of the base B during formation of the metal film F.

主权项

1. A film formation apparatus of a metal film comprising: an anode; a solid electrolyte membrane disposed between the anode and a base serving as a cathode; and a power supply unit to apply voltage between the anode and the base, the film formation apparatus being configured so that, when the solid electrolyte membrane is brought into contact with a surface of the base, and voltage is applied between the anode and the base, metal is deposited on the surface of the base from metal ions included inside of the solid electrolyte membrane, so that the metal film made of the metal is formed, wherein
the film formation apparatus comprises: a mounting base on which the base is to be placed, and a suction unit to suck the solid electrolyte membrane from a side of the base so that the solid electrolyte membrane is brought into intimate contact with the surface of the base placed on the mounting base during formation of the metal film.