发明名称 |
SUBSTRATE HOLDER AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
A substrate holder holds a stack of substrates to be plasma-processed, and includes a ring-shaped part to be placed between adjacent substrates each of which includes a process surface to be plasma-processed and a non-process surface opposite from the process surface. The ring-shaped part includes a facing surface that faces the process surface of one of the adjacent substrates, and a protrusion formed along the outer periphery of the facing surface. |
申请公布号 |
US2016265107(A1) |
申请公布日期 |
2016.09.15 |
申请号 |
US201615055737 |
申请日期 |
2016.02.29 |
申请人 |
Tokyo Electron Limited |
发明人 |
OIKAWA Masami |
分类号 |
C23C16/455;C23C16/458;C23C16/50;H01L21/687 |
主分类号 |
C23C16/455 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate holder for holding a stack of substrates to be plasma-processed, the substrate holder comprising:
a ring-shaped part to be placed between adjacent substrates each of which includes a process surface to be plasma-processed and a non-process surface opposite from the process surface, wherein the ring-shaped part includes a facing surface that faces the process surface of one of the adjacent substrates, and a protrusion that is formed along an outer periphery of the facing surface and protrudes toward the process surface of the one of the adjacent substrates. |
地址 |
Tokyo JP |