| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which one of first solder and second solder can be suppressed from wetting and spreading toward the other, and a method for manufacturing the semiconductor device.SOLUTION: A semiconductor device 10 includes: a semiconductor chip 11 having an emitter electrode 12 on one surface 11a; a first heat sink 23 disposed on an emitter side; a terminal 18 interposed between the semiconductor chip and the first heat sink; first solder 17 connecting between the emitter electrode and the terminal; and second solder 22 connecting between the terminal and the first heat sink. The terminal has a base material 19a formed using a metal material and a film 19b formed on a base material surface. The film has: a metal thin film 20; and a recessed and protruding oxide film 21 formed by irradiating the metal thin film 20 with a laser beam and having a surface on which continuous irregularities are formed. The recessed and protruding oxide film is formed, on the surface of the terminal, in at least a part of a connection region 18f that connects to each other a first connection region 18d to which the first solder is connected and a second connection region 18e to which the second solder is connoted.SELECTED DRAWING: Figure 2 |
