| 摘要 |
PROBLEM TO BE SOLVED: To enable sure application of test signals from desired signal levels, even when applying test signals with low amplitude to an object to be tested, by especially applying a test device of integrated circuits formed on a semiconductor wafer, with respect to the test device. SOLUTION: The test signal S1, outputted from a test head 3 by an attenuator 11 provided on a DUT board 8, is attenuated to be applied to the object 4 to be tested. COPYRIGHT: (C)2006,JPO&NCIPI
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