发明名称 Design Structures Incorporating Semiconductor Device Structures with Reduced Junction Capacitance and Drain Induced Barrier Lowering
摘要 Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes semiconductor device structures characterized by reduced junction capacitance and drain induced barrier lowering. The semiconductor device structure of the design structure includes a semiconductor layer and a dielectric layer disposed between the semiconductor layer and the substrate. The dielectric layer includes a first dielectric region with a first dielectric constant and a second dielectric region with a second dielectric constant that is greater than the first dielectric constant.
申请公布号 US2008034335(A1) 申请公布日期 2008.02.07
申请号 US20070875013 申请日期 2007.10.19
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHENG KANGGUO;HSU LOUIS L.;MANDELMAN JACK A.;YANG HAINING
分类号 G11C29/54 主分类号 G11C29/54
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