WAFER LEVEL SEMICONDUCTOR CHIP PACKAGES AND METHODS OF MAKING THE SAME

摘要

A wafer (20) having a front surface and contacts (28) exposed at the front surface is treated by forming electrically conductive risers (30) projecting upwardly from the contacts as, for example, by electroless plating, and then applying a flowable material over the front surface of the device, around the risers, to form a dielectric layer (36) with the risers exposed at a top surface (38) of the dielectric layer facing away from the device. Traces (42). extending over the top surface of the dielectric layer may be formed, and may be connected to at least some of the risers.