| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for stripping a resist and a resist stripping device capable of favorably stripping a resist having a surface hardened layer formed thereon from the surface of a substrate. SOLUTION: When a process chamber 11 is loaded with a substrate W, the substrate W sucked and held by a plate 14 is heat treated by heat generation from a heater 19 for heating a substrate. A controller drives and controls the heater 19 for heating a substrate to keep the temperature of the substrate W in a temperature range from 300°C to 450°C. When a popping phenomenon occurs in the resist by heating the substrate W, the surface hardened layer suffers cracks by the impact of popping in an unhardened layer inside (in an underlay side) the surface hardened layer and the unhardened layer is ashed. Consecutively, by removing the resist by use of a high-pressure fluid after the heat treatment, the resist together with the surface hardened layer is stripped from the substrate surface. COPYRIGHT: (C)2008,JPO&INPIT |
