| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical module suitable for being mounted on a substrate, wherein short circuit of a lead pin through solder is prevented. SOLUTION: The optical module is provided with a semiconductor element 14, a grounded metallic component 10 on which the semiconductor element 14 is mounted, the substrate 16 for mounting the grounded metallic component 10, and the lead pin 18 which is fixed to the grounded metallic component 10 through insulation and is soldered to the substrate 16 for energizing the semiconductor element 14. The grounded metallic component 10 is so constructed that it has a protrusion on the opposite side of the substrate 16 and its protrusion comes into contact with the substrate 16. COPYRIGHT: (C)2008,JPO&INPIT
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