| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for plating even a large object, such as a printed circuit board, in the state of applying a magnetic field by using the conventional plating equipment, and to provide a tool for plating adequately used in the method. SOLUTION: An object to be plated 2 is placed in a magnetic circuit formed by the tool immersed into a plating liquid. For example, a magnetic circuit is formed by a pair of opposing yokes 3 and a magnet 1 connected thereto, and the tool for plating having a gap in which the object to be plated can be arranged is used. COPYRIGHT: (C)2008,JPO&INPIT
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