发明名称 HEAT DISSIPATING ASSEMBLY WITH REDUCED THERMAL GRADIENT
摘要 A device to dissipate thermal energy generated by a heat generating component. The device includes a base plate and a housing secured to and disposed on the base plate to form an enclosed space surrounded thereby. The device also includes a plurality of fins secured to the base plate and disposed in the space; an inlet pipe for introducing cooling fluid into the space and an outlet pipe for exhausting the cooling fluid from the space. The inlet pipe has a flow exit positioned over the fins so that the cooling fluid flows from the top portions of the fins toward the base plate.
申请公布号 US2009101316(A1) 申请公布日期 2009.04.23
申请号 US20070874655 申请日期 2007.10.18
申请人 EVGA CORPORATION 发明人 HAN TAI-SHENG (ANDREW)
分类号 F28D15/00 主分类号 F28D15/00
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