| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a sensor device and a sensor device capable of suppressing damage to a thin portion and variations in sensor characteristics, while ensuring an electrically connected state between a sensor chip and an external connection lead. <P>SOLUTION: A sensor chip in which a detection part and a wiring part connected to the detection part are formed on a substrate, having a cavity and a resistor composing the detection part, is formed on a thin portion above the cavity, and a lead frame including a support lead and an external connection lead are prepared. After a laminate is formed by fixing the prepared sensor chip on the support lead via an adhesive member, the external connection lead is electrically connected to the wiring part. The laminate and a stopper, having hardness closer to that of the substrate than that of the adhesive member; are disposed in the cavity configured in a pair of molds, and molding is performed with the stopper being held in between the two molds, while the one of the molds is in contact with the top surface of the sensor chip. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
