| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device, which can inhibit mold flash well and improve productivity of the semiconductor device.SOLUTION: An adhesive sheet 10 for manufacturing a semiconductor device includes a base material and a thermosetting adhesive layer provided on one surface of the base material, and is detachably attached to a lead frame 20 or a wiring board of the semiconductor device. The adhesive layer has an adhesive strength a before heating which is measured by a specific peel test A is 0.07 N/20 mm and more; an adhesive strength b after heating which is measured by a specific peel test B is 0.58 N/20 mm and more; and an adhesive strength c after heating which is measured by a specific peel test C is 1.17 N/20 mm and more. |
