发明名称 |
SUBSTRATE COMPRISING STACKS OF INTERCONNECTS, INTERCONNECT ON SOLDER RESIST LAYER AND INTERCONNECT ON SIDE PORTION OF SUBSTRATE |
摘要 |
An integrated circuit device that includes a package substrate and a die coupled to the package substrate. The package substrate includes at least one dielectric layer, a first stack of first interconnects in the at least one dielectric layer, and a second interconnect formed on at least one side portion of the at least one dielectric layer. The first stack of first interconnects is configured to provide a first electrical path for a non-ground reference signal, where the first stack of first interconnects is located along at least one side of the package substrate. The second interconnect is configured to provide a second electrical path for a ground reference signal. |
申请公布号 |
WO2016134070(A1) |
申请公布日期 |
2016.08.25 |
申请号 |
WO2016US18345 |
申请日期 |
2016.02.17 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
JOW, Uei-Ming;SONG, Young Kyu;LEE, Jong-Hoon;ZHANG, Xiaonan;VELEZ, Mario Francisco |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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