Pressure sensor especially of semiconductor type

摘要

The pressure sensor has a sensing body (2) with a pressure sensitive diaphragm (2a), a silicon chip (4), a glass coating (5) bonded to the diaphragm, and a characteristic bubble formed in the glass coating within predefined manufacturing tolerances. The sensing body is mounted in a housing (1) when the bubble has been formed in the glass coating and it has been established that the bubble is within the manufacturing tolerances. An Independent claim is also included for a method of producing a semiconducting pressure sensor.